Completely encapsulated top electrode of a ferroelectric capacitor using a lead-enhanced encapsulation layer

ABSTRACT

A ferroelectric capacitor includes a bottom electrode, a top electrode, and a ferroelectric layer located between the top and bottom electrodes that extends to completely encapsulate the top electrode, except for a contact hole to allow metalization of the top electrode. The total encapsulation of the top electrode reduces the sensitivity of the ferroelectric capacitor to hydrogen and thus improves electrical switching performance.

This application is a is a division of application Ser. No. 09/085,280,filed on May 27, 1998, now U.S. Pat. No. 6,211,542, issued Apr. 3, 2001,which is a continuation in part of application Ser. No. 08/828,157,filed Mar. 27, 1997, now U.S. Pat. No. 6,027,947, issued Feb. 22, 2000,which is a continuation in part of application Ser. No. 08/728,740,filed Oct. 10, 1996, now U.S. Pat. No. 5,864,932, issued Feb. 2, 1999,which continuation-in-part of my co-pending application entitled“COMPLETELY OR PARTIALLY ENCAPSULATED TOP ELECTRODE OF A FERROELECTRICCAPACITOR” filed on Aug. 20, 1996 and having Ser. No. 08/700,076 nowU.S. Pat. No. 5,920,453, issued Jul. 7, 1999.

BACKGROUND OF THE INVENTION

This invention relates generally to ferroelectric capacitors. Moreparticularly, the present invention relates to a technique and structurefor preventing degradation in the electrical performance offerroelectric capacitors.

A portion of a prior art integrated circuit ferroelectric memory cell 10including a transistor and a ferroelectric capacitor is shown in FIG. 1.A silicon or other substrate 12 includes a diffused region 14, whichforms part of a transistor used in the memory cell. A thick oxide layer16 forms the substrate for the ferroelectric capacitor. The thick oxidelayer 16 is patterned and etched to allow access to diffused region 14.The ferroelectric capacitor includes a platinum bottom electrode 18, aferroelectric layer 20, typically PZT (lead zirconate titanate), and aplatinum top electrode 22. A subsequent oxide layer 24 is deposited,which is patterned and etched, to provide access to diffused region 14,bottom electrode 18, and to top electrode 22. A local interconnect layer26 is deposited, patterned and etched, to provide a local interconnect26A between top electrode 22 and diffused region 14, as well asmetalization 26B for bottom electrode 18.

It is well known in the ferroelectric arts that certain ferroelectricmaterials, particularly PZT, are susceptible to degradation ofelectrical switching performance if exposed to hydrogen. One source ofhydrogen can be found in the plastic packaging materials often used withintegrated circuits. Another source of hydrogen can be found in thevarious oxide layers used in fabricating the ferroelectric capacitor ormemory cell.

A section 28 of memory cell 10 is shown in greater magnification in FIG.2 to illustrate the problem of hydrogen sensitivity that exists withinthe prior art memory cell. Section 28 shows oxide layer 16, bottomelectrode 18, ferroelectric layer 20, top electrode 22, oxide layer 24,and local interconnect 26A. Note particularly in FIG. 2 that there is aninterface between oxide layer 24 and ferroelectric layer 20. Theinterface extends along the top surface and sides of ferroelectric layer20. During and after fabrication, hydrogen is generated within oxidelayer 24, which in turn is gradually absorbed by ferroelectric layer 20.The arrows shown in FIG. 2 show generally the probable path of hydrogendiffusion into the ferroelectric layer 20. Studies have shown thatexposure to hydrogen gradually degrades the amount of switching chargeproduced by the ferroelectric capacitor. Over time, the exposure tohydrogen may destroy electrical switching performance altogether.

What is desired, therefore, is a technique and structure to reducehydrogen sensitivity in an integrated ferroelectric capacitor.

SUMMARY OF THE INVENTION

It is, therefore, a principal object of the present invention to improvethe electrical switching performance of integrated circuit ferroelectriccapacitors by reducing sensitivity to hydrogen.

It is another object of the invention to improve the performance offerroelectric memory circuits.

It is an advantage of the invention that the fabrication methods setforth are generally compatible with existing ferroelectric capacitor andferroelectric memory fabrication methods.

It is another advantage of the invention that the capacitor fabricatedas set forth herein can be used in a wide array of electronic productssuch as integrated circuit memories and other integrated circuits, RF/IDintegrated circuits and cards, discrete devices, or any application inwhich improved electrical switching performance and resistance tohydrogen diffusion is desired.

According to a first general embodiment of the present invention, aferroelectric capacitor includes a bottom electrode, a top electrode,and a ferroelectric layer located between the top and bottom electrodesthat extends to completely encapsulate the top electrode, except for acontact hole to allow metalization of the top electrode. The totalencapsulation of the top electrode reduces the sensitivity of theferroelectric capacitor to hydrogen and thus improves electricalswitching performance.

According to a second general embodiment of the present invention, aferroelectric capacitor includes a bottom electrode and a ferroelectriclayer formed on the bottom electrode. The ferroelectric layer ispartially etched to form an indentation to receive a top electrode. Adielectric layer is formed over the ferroelectric layer, and includes acontact hole to allow metalization of the top electrode. The partialencapsulation of the top electrode also reduces the sensitivity of theferroelectric capacitor to hydrogen.

The ferroelectric layer in the capacitor can be fabricated using PZT,SBT, or other known ferroelectric materials. The ferroelectric capacitorcan then be used in conjunction with a transistor to form a memory cellin an array of such cells.

A first method of fabricating a ferroelectric capacitor according to thepresent invention includes the steps of: forming in sequence a bottomelectrode layer, a first ferroelectric layer, and a top electrode layer;etching the top electrode layer to form a top electrode; forming asecond ferroelectric layer over the first ferroelectric layer, therebycompletely encapsulating the top electrode; etching the secondferroelectric layer; etching the first ferroelectric layer and thebottom electrode layer to form a bottom electrode; forming a dielectriclayer over the etched first ferroelectric and second ferroelectriclayers; etching a contact hole through the dielectric layer and thesecond ferroelectric layer to allow metalization of the top electrode;and etching a contact hole through the dielectric layer and the firstferroelectric layer to allow metalization of the bottom electrode.

A second method of fabricating a ferroelectric capacitor according tothe present invention includes the steps of: forming in sequence abottom electrode layer, a first ferroelectric layer, and a top electrodelayer; etching the top electrode layer to form a top electrode; etchingthe first ferroelectric layer; etching the bottom electrode layer toform a bottom electrode; forming a second ferroelectric layer over thefirst ferroelectric layer, thereby completely encapsulating the topelectrode; etching the second ferroelectric layer so that the secondferroelectric layer overlaps the bottom electrode; forming a dielectriclayer over the etched second ferroelectric layer; and etching contactholes through the dielectric layer and the second ferroelectric layer toallow metalization of the top and bottom electrodes.

A third method of fabricating a ferroelectric capacitor according to thepresent invention includes the steps of: forming in sequence a bottomelectrode layer, a first ferroelectric layer, and a top electrode layer;etching the top electrode layer to form a top electrode; etching thefirst ferroelectric layer; etching the bottom electrode layer to form abottom electrode; forming a second ferroelectric layer over the firstferroelectric layer, thereby completely encapsulating the top electrode;forming a dielectric layer over the second ferroelectric layer; andetching contact holes through the dielectric layer and the secondferroelectric layer to allow metalization of the top and bottomelectrodes.

A fourth method of fabricating a ferroelectric capacitor according tothe present invention includes the steps of: forming in sequence abottom electrode layer, a first ferroelectric layer of a firstthickness, and a top electrode layer; etching the top electrode layer toform a top electrode; etching the first ferroelectric layer; forming asecond ferroelectric layer of a second thickness over the firstferroelectric layer, thereby completely encapsulating the top electrode;etching the second ferroelectric layer and the bottom electrode layer toform a bottom electrode; forming a dielectric layer over the etchedsecond ferroelectric layer; and etching contact holes through thedielectric layer and the second ferroelectric layer to allowmetalization of the top and bottom electrodes.

A fifth method of fabricating a ferroelectric capacitor according to thepresent invention includes the steps of: forming in sequence a bottomelectrode layer and a ferroelectric layer; partially etching theferroelectric layer to form an indentation; forming a conformal topelectrode layer over the ferroelectric layer; etching away the topelectrode layer to form a top electrode in the indentation; etching theferroelectric layer; etching the bottom electrode layer to form a bottomelectrode; forming a dielectric layer over the etched ferroelectriclayer; and etching contact holes through the dielectric layer to allowmetalization of the top and bottom electrodes.

A sixth method of fabricating a ferroelectric capacitor according to thepresent invention includes the steps of: forming a bottom electrodelayer; etching the bottom electrode layer to form a bottom electrode;forming a ferroelectric layer over the bottom electrode; partiallyetching the ferroelectric layer to form an indentation; forming aconformal top electrode layer over the ferroelectric layer; etching awaythe top electrode layer to form a top electrode in the indentation;forming a dielectric layer over the ferroelectric layer; etching acontact hole through the dielectric layer to allow metalization of thetop electrodes; and etching a contact hole through the dielectric layerand the ferroelectric layer to allow metalization of the bottomelectrode.

An integrated circuit ferroelectric memory cell having a bit line, aword line, and a plate line, fabricated according to the presentinvention includes: a silicon substrate or epitaxial region; atransistor formed in the substrate including first and second diffusedregions, a thin gate oxide, and a gate forming the word line; a thickoxide layer formed on the substrate including contact holes to allowmetalization of the first and second diffused regions; a ferroelectriccapacitor formed on the thick oxide layer, the ferroelectric capacitorincluding a bottom electrode, a ferroelectric layer, and a topelectrode, wherein the ferroelectric layer either partially orcompletely encapsulates the top electrode and includes a contact hole toallow metalization of the top electrode; a first dielectric layer formedover the thick oxide layer and the ferroelectric capacitor includingcontact holes to allow metalization of the first and second diffusedregions, and the top and bottom electrodes of the ferroelectriccapacitor; a first patterned metalization layer for contacting the firstdiffused region, for forming a local interconnect between the topelectrode and the second diffused region, and for metalizing the bottomelectrode; a second dielectric layer formed over the first metalizationlayer including contact holes to allow metalization of the firstdiffused region and the bottom electrode; a second patternedmetalization layer for contacting the first diffused region to form thebit line, and for contacting the bottom electrode to form the plateline; and a passivation layer formed over the second metalization layer.If desired, the first dielectric layer, the second dielectric layer, andthe passivation layer can each be formed as a ferroelectric layer for aneven greater resistance to hydrogen degradation.

The foregoing and other objects, features and advantages of theinvention will become more readily apparent from the following detaileddescription of a preferred embodiment of the invention which proceedswith reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a portion of a prior art integratedcircuit ferroelectric memory including a ferroelectric capacitor and atransistor;

FIG. 2 is a magnified view of a prior art ferroelectric capacitorillustrating particularly the problem of hydrogen diffusion into theferroelectric dielectric layer resulting in degradation of electricalswitching performance;

FIGS. 3-9 are sequential sectional views of a ferroelectric capacitorprocess suitable for use in a ferroelectric memory having decreasedhydrogen sensitivity according to a first embodiment of the invention;

FIG. 10 is a plan view of a set of ferroelectric capacitors fabricatedaccording to the process shown in FIGS. 3-9;

FIGS. 11-17 are sequential sectional views of a ferroelectric capacitorprocess suitable for use in a ferroelectric memory having decreasedhydrogen sensitivity according to a second embodiment of the invention;

FIG. 18 is a plan view of a set of ferroelectric capacitor fabricatedaccording to the process shown in FIGS. 11-17;

FIGS. 19-24 are sequential sectional views of a ferroelectric capacitorprocess suitable for use in a ferroelectric memory having decreasedhydrogen sensitivity according to a third embodiment of the invention;

FIG. 25 is a plan view of a set of ferroelectric capacitor fabricatedaccording to the process shown in FIGS. 19-24;

FIGS. 26-32 are sequential sectional views of a ferroelectric capacitorprocess suitable for use in a ferroelectric memory having decreasedhydrogen sensitivity according to a fourth embodiment of the invention;

FIGS. 33-41 are sequential sectional views of a ferroelectric capacitorprocess suitable for use in a ferroelectric memory having decreasedhydrogen sensitivity according to a fifth embodiment of the invention;

FIGS. 42-50 are sequential sectional views of a ferroelectric capacitorprocess suitable for use in a ferroelectric memory having decreasedhydrogen sensitivity according to a sixth embodiment of the invention;

FIG. 51 is a schematic diagram of a ferroelectric memory cell having atransistor and a ferroelectric capacitor; and

FIG. 52 is a sectional view of a completely metalized integrated circuitferroelectric memory, in which the top electrode of the ferroelectriccapacitor is completely encapsulated according to the present invention.

DETAILED DESCRIPTION

Referring now to FIGS. 3-9, sequential sectional views of a firstferroelectric capacitor process suitable for use in a ferroelectricmemory having decreased hydrogen sensitivity are shown.

In FIG. 3, a layer 16 of BPSG glass about 7000 Angstroms thick isdeposited onto a silicon or other substrate (not shown). Any oxide,nitride, or other appropriate dielectric layer can be substituted forBPSG layer 16. A platinum bottom electrode layer 18 is subsequentlydeposited over BPSG glass layer 16 to a thickness of about 1750Angstroms. While platinum is used for electrode layer 18, other knownmaterials compatible with ferroelectric films can be used includingiridium, iridium oxide, and the like. The bottom electrode layer 16 alsoincludes a titanium adhesion layer about 200 Angstroms thick tofacilitate the adhesion of the platinum bottom electrode layer 18 toBPSG glass layer 16. A first ferroelectric layer 20 is subsequentlydeposited over the bottom electrode layer 18 to a thickness of about3000 Angstroms. The material used in ferroelectric layer 20 is ideallydoped or undoped PZT (lead zirconate titanate), SBT (strontium bismuthtantalate), or any other known ferroelectric material suitable for usein thin film form. After the ferroelectric layer 20 is deposited, afirst anneal is performed. The first anneal includes a 650° C. heattreatment for about five seconds, followed by an 850° C. heat treatmentfor about five seconds.

A platinum top electrode layer 22 is subsequently deposited over thefirst ferroelectric layer 20 to a thickness of about 1750 Angstroms. Thematerial used in top electrode layer 22 can be other than platinum asdescribed above. Top electrode layer 22 is etched to form one or moretop electrodes. Platinum is typically etched using a reactive-ion etchin an argon and chlorine atmosphere, although other gases can be used.Ion milling can be used as well as an alternative etching technique. Thedimensions of the individual top electrodes can modified as desired fromnominal dimensions of 1.5×1.5 microns, with a spacing of about threemicrons between top electrodes. After the platinum top electrode layer20 is etched to define the individual top electrodes, a second anneal isperformed. The second anneal includes a 650° C. heat treatment for aboutsixty minutes in an oxygen atmosphere.

In FIG. 4, a second “cap” ferroelectric layer 30 about the samethickness (3000 Angstroms) as the first ferroelectric layer 20 isdeposited over the first ferroelectric layer 20, thereby completelyencapsulating the top electrodes 22. The material used in the secondferroelectric layer 30 is also ideally doped or undoped PZT (leadzirconate titanate), SBT (strontium bismuth tantalate), or any otherknown ferroelectric material suitable for use in thin film form. Thefirst and second ferroelectric layers need not be the same ferroelectricmaterial, since the second layer is used for its resistance to hydrogendiffusion or hydrogen “gettering” properties and not specifically forits ferroelectric properties. After the second ferroelectric layer 30 isdeposited, an optional third anneal can be performed. The optional thirdanneal includes a 650° C. heat treatment for about sixty minutes in anoxygen atmosphere.

In FIG. 5, the second ferroelectric layer 30 is etched according to thesame etching method as set forth for the first ferroelectric layer 20.The second ferroelectric layer 30 is etched to leave a reasonableoverlap of the top electrodes 22, about 1.5 to 2.0 microns.

In FIG. 6, the first ferroelectric layer 20 and the bottom electrodelayer 18 are simultaneously etched to define the dimensions of a bottomelectrode. As can be seen in FIG. 6, one end of the bottom electrode 18is etched to allow sufficient room for an eventual bottom electrodecontact. The other end of bottom electrode 18 is etched to the samedimensions as the second ferroelectric layer 30. The first ferroelectriclayer 20 and the bottom electrode layer 18 are simultaneously etchedusing a reactive-ion etch in an argon and carbon tetrafluorideatmosphere, although other gases can be used. Ion milling can also beused as an alternative etching technique. After the first ferroelectriclayer 20 and bottom electrode layer 18 are etched, an optional firstrecovery anneal can be performed. The optional first recovery annealincludes a 550° C. heat treatment for about sixty minutes in an oxygenatmosphere.

In FIG. 7, a PTEOS glass dielectric layer 24 is deposited over theetched first ferroelectric and second ferroelectric layers 20 and 30 toa thickness of about 5000 Angstroms. Other dielectric layers can be usedfor dielectric layer 24.

In FIG. 8, contact holes are etched to provide access of the top andbottom electrodes 22 and 18. Contact hole 32 provides access to bottomelectrode 18, and contact holes 34 provide access to top electrodes 22.Contact holes 34 are etched through the dielectric layer 24 and thesecond ferroelectric layer 30 to allow metalization of the topelectrodes. Contact hole 32 is etched through the dielectric layer 24and the first ferroelectric layer 20 to allow metalization of bottomelectrode 18. Note that the contact holes 32 and 34 are ideally etchedin two steps. The first etching step removes the dielectric layer 24 inthe contact holes. The dielectric oxide material can be etched awayusing a fluorine-based wet or dry etch. It is desirable that a slopedprofile is etched into the contact holes. After the dielectric oxidematerial is removed, the remaining ferroelectric material in the contacthole is etched away according to the ferroelectric etch described above.Note in FIG. 8 that contact holes 32 and 34 are etched through about thesame thickness of material, i.e. 5000 Angstroms of glass plus 3000Angstroms of ferroelectric material. Therefore, the etching of contactholes 32 and 34 can be performed simultaneously. After contact holes 32and 34 are etched, an optional second recovery anneal can be performed.The optional second recovery anneal includes a 550° C. heat treatmentfor about sixty minutes in an oxygen atmosphere.

In FIG. 9, contact holes 32 and 34 are metalized to provide electricalaccess to bottom electrode 18 and top electrodes 22. A titanium nitridelocal interconnect metalization layer is deposited to a thickness ofabout 800 Angstroms and etched to form a metal contact 36 for bottomelectrode 18 and a metal contact 38 for each of the top electrodes 22.The full metalization scheme showing subsequent oxide and metalizationlayers for a ferroelectric memory cell is shown in FIG. 52, althoughother metalization schemes can be used. For example, a titanium layerabout 1500 Angstroms thick followed by an aluminum layer of about 8000Angstroms thick can be used to form metal contacts 36 and 38. Othermetalization techniques can be used as well after the titanium nitridelayer has been deposited.

A plan view of the capacitor structure described above with respect toFIGS. 3-9 is shown in FIG. 10. The bottom electrode 18 and firstferroelectric layer 20 are shown as coincident layers forming a firstrectangle. A second, smaller rectangle is formed of the bottom electrode18, the first ferroelectric layer 20, and the second ferroelectric layer30. The contact holes to the bottom and top electrodes 32 and 34 areshown as circular features. The local interconnect metal contact straps38 that contact the top electrodes 22 are shown as individual rectanglesoverlapping contact holes 34 and 40. Contact holes 40 are not shown inFIGS. 3-9 but represent a contact to another structure such as thediffused region of a transistor as is shown in FIG. 52.

Referring now to FIGS. 11-17, sequential sectional views of a secondferroelectric capacitor process suitable for use in a ferroelectricmemory having decreased hydrogen sensitivity are shown.

FIG. 11 is the same sectional view as FIG. 3, showing the sequentialdeposition of a thick glass layer 16, a bottom electrode layer 18, afirst ferroelectric layer 20, and a top electrode layer 22. All of thethicknesses and materials described above are the same in FIG. 11. Afirst anneal can be performed after the first ferroelectric layer 18 isdeposited. The platinum top electrode layer 22 is etched to formindividual top electrodes 22. A second anneal can be performed after thetop electrodes 22 are etched.

In FIG. 12, the first ferroelectric layer 20 is etched with some lateraloverlap of the etched top electrodes 22. The bottom electrode layer 18is etched to define the dimensions of a bottom electrode. As can be seenin FIG. 12, one end of the bottom electrode 18 is etched to allowsufficient room for the eventual bottom electrode contact. The other endof bottom electrode 18 is etched to the same dimensions as the firstferroelectric layer 20. The etching techniques for bottom electrode 18and first ferroelectric layer 20 are as described above with referenceto FIGS. 3-11. After the first ferroelectric layer 20 and bottomelectrode layer 18 are etched, an optional first recovery anneal can beperformed. The optional first recovery anneal includes a 550° C. heattreatment for about sixty minutes in an oxygen atmosphere.

In FIG. 13, a second “cap” ferroelectric layer 30 about the samethickness (3000 Angstroms) as the first ferroelectric layer 20 isdeposited over the first ferroelectric layer 20, thereby completelyencapsulating the top electrodes 22.

After the second ferroelectric layer 30 is deposited, an optional thirdanneal can be performed. The optional third anneal includes a 650° C.heat treatment for about sixty minutes in an oxygen atmosphere.

In FIG. 14, the second ferroelectric layer 30 is etched according to thesame etching method as set forth for the first ferroelectric layer 20.The second ferroelectric layer 30 is etched to leave a reasonableoverlap of the bottom electrode 18, about 1.5 to 2.0 microns. After thesecond ferroelectric layer 30 is etched, an optional second recoveryanneal can be performed.

In FIG. 15, a PTEOS glass dielectric layer 24 is deposited over theetched second ferroelectric layers 30 to a thickness of about 5000Angstroms.

In FIG. 16, contact holes are etched to provide access of the top andbottom electrodes 22 and 18. Contact hole 32 provides access to bottomelectrode 18, and contact holes 34 provide access to top electrodes 22.Note that in FIG. 16, both contact holes 34 and 32 are etched throughthe dielectric layer 24 and the second ferroelectric layer 30 to allowmetalization of the top and bottom electrodes. The thickness of contactholes 34 and 32 is the same since they are etched through the samethickness of material. Contact holes 32 and 34 are ideallysimultaneously etched in two steps to remove the dielectric oxidematerial and then the remaining ferroelectric material. The type of etchused in the same as described with reference to FIG. 8. After contactholes 32 and 34 are etched, an optional second recovery anneal can beperformed.

In FIG. 17, contact holes 32 and 34 are metalized to provide electricalaccess to bottom electrode 18 and top electrodes 22. A titanium nitridelocal interconnect metalization layer is deposited to a thickness ofabout 800 Angstroms and etched to form a metal contact 36 for bottomelectrode 18 and a metal contact 38 for each of the top electrodes 22.The full metalization scheme showing subsequent oxide and metalizationlayers for a ferroelectric memory cell is shown in FIG. 52, althoughother metalization schemes can be used.

A plan view of the capacitor structure described above with respect toFIGS. 11-17 is shown in FIG. 18. The bottom electrode 18 is shown asforming a first rectangle. A second, smaller rectangle is formed of thebottom electrode 18 and the first ferroelectric layer 20. The secondferroelectric layer 30 is shown as a dashed rectangle overlapping thebottom electrode 18. The contact holes to the bottom and top electrodes32 and 34 are shown as circular features. The local interconnect metalcontact straps 38 that contact the top electrodes 22 are shown asindividual rectangles overlapping contact holes 34 and 40. Contact holes40 are not shown in FIGS. 11-17 but represent a contact to anotherstructure such as the diffused region of a transistor as is shown inFIG. 52.

Referring now to FIGS. 19-24, sequential sectional views of a thirdferroelectric capacitor process suitable for use in a ferroelectricmemory having decreased hydrogen sensitivity are shown.

FIGS. 19-21 are identical to previously described FIGS. 11-13 both insectional views, material, etching, and annealing steps. FIG. 19 shows athick glass layer 16, a bottom electrode layer 18, a first ferroelectriclayer 20, and a top electrode layer 22 formed in sequence, wherein thetop electrode layer 22 is etched to form individual top electrodes 22.FIG. 20 shows the etching of the first ferroelectric layer 20 and theetching of the bottom electrode layer 18 to form a bottom electrode. InFIG. 21, a second “cap” ferroelectric layer 30 about the same thickness(3000 Angstroms) as the first ferroelectric layer 20 is deposited overthe first ferroelectric layer 20, thereby completely encapsulating thetop electrodes 22. A first anneal is performed after the ferroelectriclayer 20 is deposited, a second anneal is performed after the topelectrode layer 22 is etched, and an optional third anneal is performedafter the second ferroelectric layer 30 is deposited. A optional firstrecovery anneal is performed after the first ferroelectric layer 20 andbottom electrode layer 18 have been etched.

In FIG. 22, a PTEOS glass dielectric layer 24 is deposited over theunetched second ferroelectric layer 30 to a thickness of about 5000Angstroms.

In FIG. 23, contact holes are etched to provide access of the top andbottom electrodes 22 and 18. Contact hole 32 provides access to bottomelectrode 18, and contact holes 34 provide access to top electrodes 22.Note that in FIG. 23, both contact holes 34 and 36 are etched throughthe dielectric layer 24 and the second ferroelectric layer 30 to allowmetalization of the top and bottom electrodes. The thickness of contactholes 34 and 32 is the same since they are etched through the samethickness of material. Contact holes 32 and 34 are ideallysimultaneously etched in two steps to remove the dielectric oxidematerial and then the remaining ferroelectric material. The type of etchused in the same as described with reference to FIG. 8. A secondoptional recovery anneal can be performed after contact holes 32 and 34have been opened.

In FIG. 24, contact holes 32 and 34 are metalized to provide electricalaccess to bottom electrode 18 and top electrodes 22. A titanium nitridelocal interconnect metalization layer is deposited to a thickness ofabout 800 Angstroms and etched to form a metal contact 36 for bottomelectrode 18 and a metal contact 38 for each of the top electrodes 22.The full metalization scheme showing subsequent oxide and metalizationlayers for a ferroelectric memory cell is shown in FIG. 52, althoughother metalization schemes can be used.

A plan view of the capacitor structure described above with respect toFIGS. 19-24 is shown in FIG. 25. The bottom electrode 18 is shown asforming a first rectangle. A second, smaller rectangle is formed of thebottom electrode 18 and the first ferroelectric layer 20. The secondferroelectric layer 30 is shown as a dashed rectangle overlapping thebottom electrode 18 by a wide margin. The wide margin shown is meant toconvey the unetched, continuous extent of the second ferroelectric layer30.The contact holes to the bottom and top electrodes 32 and 34 areshown as circular features. The local interconnect metal contact straps38 that contact the top electrodes 22 are shown as individual rectanglesoverlapping contact holes 34 and 40. Contact holes 40 are not shown inFIGS. 19-24 but represent a contact to another structure such as thediffused region of a transistor as is shown in FIG. 52.

Referring now to FIGS. 26-32, sequential sectional views of a fourthferroelectric capacitor process suitable for use in a ferroelectricmemory having decreased hydrogen sensitivity are shown. The fourthferroelectric capacitor process described below allows the thickness ofthe second ferroelectric layer 30 to be different from the firstferroelectric layer 20, if desired.

FIG. 26 is the same as previously described FIGS. 3, 11, and 19. A firstanneal is performed after the first ferroelectric layer 20 is deposited,and a second anneal is performed after the top electrode layer 22 isetched.

In FIG. 27, only the first ferroelectric layer 20 is etched to areasonable overlap of the etched top electrodes 22. The bottom electrodelayer 18 remains unetched in FIG. 27. An optional first recovery annealis performed after the first ferroelectric layer 20 is etched.

In FIG. 28, a second “cap” ferroelectric layer 30′ of a differentthickness (less than or greater than 3000 Angstroms) from the firstferroelectric layer 20 is deposited over the first ferroelectric layer20, thereby completely encapsulating the top electrodes 22. A less thicksecond ferroelectric layer 30′ is desirable since less material is used,it is easier to etch, more planar, and for other processing reasons.However, if desired, the same or a thicker ferroelectric layer 30′ canbe used. The material used for the second ferroelectric layer 30′ is thesame as described above, and can be different than the material used inthe first ferroelectric layer 20. An optional third anneal can beperformed after the second ferroelectric layer 30′ is deposited.

In FIG. 29, the second ferroelectric layer 30′ and the bottom electrodelayer 18 are simultaneously etched to form a bottom electrode. After thebottom electrode layer 18 and second ferroelectric layer 30′ have beenetched, an optional second recovery anneal can be performed.

In FIG. 30, a PTEOS glass dielectric layer 24 is deposited over theetched second ferroelectric layer 30′ to a thickness of about 5000Angstroms.

In FIG. 31, contact holes are etched to provide access of the top andbottom electrodes 22 and 18. Contact hole 32 provides access to bottomelectrode 18, and contact holes 34 provide access to top electrodes 22.Note that in FIG. 31, both contact holes 34 and 32 are etched throughthe dielectric layer 24 and the second ferroelectric layer 30′ to allowmetalization of the top and bottom electrodes. The thickness of contactholes 34 and 32 is the same since they are etched through the samethickness of material. Contact holes 32 and 34 are ideallysimultaneously etched in two steps to remove the dielectric oxidematerial and then the remaining ferroelectric material. The type of etchused in the same as described with reference to FIG. 8. After contactholes 32 and 34 have been etched, an optional third recovery anneal canbe performed.

In FIG. 32, contact holes 32 and 34 are metalized to provide electricalaccess to bottom electrode 18 and top electrodes 22. The fullmetalization scheme showing subsequent oxide and metalization layers fora ferroelectric memory cell is shown in FIG. 52, although othermetalization schemes can be used.

A plan view of the capacitor structure described above with respect toFIGS. 26-32 is not shown, but is similar to the plan view shown in FIG.18. The one difference is that the second ferroelectric layer 30′ doesnot overlap the bottom electrode 18, but is coincident thereto.

Referring now to FIGS. 33-41, sequential sectional views of a fifthferroelectric capacitor process suitable for use in a ferroelectricmemory having decreased hydrogen sensitivity are shown.

In FIG. 33, a layer 16 of BPSG glass about 7000 Angstroms thick isdeposited onto a silicon or other substrate (not shown). A platinumbottom electrode layer 18 is subsequently deposited over BPSG glasslayer 16 to a thickness of about 1750 Angstroms. The bottom electrodelayer 18 also includes a titanium adhesion layer about 200 Angstromsthick to facilitate the adhesion of the platinum bottom electrode layer18 to BPSG glass layer 16. A ferroelectric layer 20 is subsequentlydeposited over the bottom electrode layer 18 to a thickness of about3000 Angstroms. The material used in ferroelectric layer 20 is ideallydoped or undoped PZT (lead zirconate titanate), SBT (strontium bismuthtantalate), or any other known ferroelectric material suitable for usein thin film form.

In FIG. 34 the ferroelectric layer 20 is partially etched to form one ormore indentations 42. Indentations 42 should be etched to a sufficientdepth to completely receive the top electrodes as is explained infurther detail below. The etching technique used is the samereactive-ion etch used in etching the ferroelectric layers. After theferroelectric layer 20 is partially etched, a first anneal is performed.The first anneal includes a 650° C. heat treatment for about fiveseconds, followed by an 850° C. heat treatment for about five seconds.

In FIG. 35, a platinum top electrode layer 22 is subsequently depositedover the ferroelectric layer 20 to a thickness of about 1750 Angstroms.The top electrode layer 22 is conformal and thus fills in each of theindentations 42.

In FIG. 36, the top electrode layer 22 is etched away to form one ormore top electrodes in indentations 42. Platinum is typically etchedusing a reactive-ion etch in an argon and chlorine atmosphere.Alternative etching techniques include ion milling or chemicalmechanical polishing (CMP). The dimensions of the individual topelectrodes can modified as desired from nominal dimensions of 1.5×1.5microns, with a spacing of about three microns between top electrodes.After the platinum top electrode layer 20 is etched to define theindividual top electrodes, a second anneal is performed. The secondanneal includes a 650° C. heat treatment for about sixty minutes in anoxygen atmosphere.

In FIG. 37, the ferroelectric layer 20 is etched to leave a reasonablelateral overlap of the top electrodes 22.

In FIG. 38, the bottom electrode layer 18 is etched to define thedimensions of a bottom electrode. As can be seen in FIG. 38, one end ofthe bottom electrode 18 is etched to allow room for an eventual bottomelectrode contact. The other end of bottom electrode 18 is etched to thesame dimensions as the second ferroelectric layer 30. The bottomelectrode layer 18 is etched using a reactive-ion etch in an argon andchlorine atmosphere. After the bottom electrode layer 18 is etched, anoptional first recovery anneal can be performed. The optional firstrecovery anneal includes a 550° C. heat treatment for about sixtyminutes in an oxygen atmosphere.

In FIG. 39, a PTEOS glass dielectric layer 24 is deposited over theetched ferroelectric layer 20 to a thickness of about 5000 Angstroms.

In FIG. 40, contact holes are etched to provide access of the top andbottom electrodes 22 and 18. Contact hole 32 provides access to bottomelectrode 18, and contact holes 34 provide access to top electrodes 22.Contact holes 34 and 32 are etched through the dielectric layer 24 toallow metalization of the top electrodes and bottom electrodes 22 and18. Note that the contact holes 32 and 34 are etched in a single etchingstep. The dielectric oxide material can be etched away using afluorine-based wet or dry etch. It is desirable that a sloped profile isetched into the contact holes. Note in FIG. 40 that contact holes 32 and34 are etched through about the same thickness of material, i.e. 5000Angstroms of glass dielectric layer 24. A second optional recoveryanneal can be performed after contact holes 32 and 34 are opened aspreviously described.

In FIG. 41, contact holes 32 and 34 are metalized to provide electricalaccess to bottom electrode 18 and top electrodes 22 as previouslydescribed above.

A plan view of the capacitor structure described above with respect toFIGS. 33-41 is similar to that shown in FIG. 10. The only difference isthat there is no second level of ferroelectric material 30. The contoursof the plan view, however, are the same.

Referring now to FIGS. 42-50, sequential sectional views of a sixthferroelectric capacitor process suitable for use in a ferroelectricmemory having decreased hydrogen sensitivity are shown.

In FIG. 42, a layer 16 of BPSG glass about 7000 Angstroms thick isdeposited onto a silicon or other substrate (not shown). A platinumbottom electrode layer 18 is subsequently deposited over BPSG glasslayer 16 to a thickness of about 1750 Angstroms. The bottom electrodelayer 18 also includes a titanium adhesion layer about 200 Angstromsthick to facilitate the adhesion of the platinum bottom electrode layer18 to BPSG glass layer 16.

In FIG. 43, bottom electrode layer 18 is etched to form a bottomelectrode.

In FIG. 44, A ferroelectric layer 20 is subsequently deposited over thebottom electrode 18 to a thickness of about 3000 Angstroms. The materialused in ferroelectric layer 20 is ideally doped or undoped PZT (leadzirconate titanate), SBT (strontium bismuth tantalate), or any otherknown ferroelectric material suitable for use in thin film form.

In FIG. 45 the ferroelectric layer 20 is partially etched to form one ormore indentations 42. Indentations 42 should be etched to a sufficientdepth to completely receive the top electrodes as is explained infurther detail below. The etching technique used is the samereactive-ion etch used in etching the ferroelectric layers. After theferroelectric layer 20 is partially etched, a first anneal is performed.The first anneal includes a 650° C. heat treatment for about fiveseconds, followed by an 850° C. heat treatment for about five seconds.

In FIG. 46, a platinum top electrode layer 22 is subsequently depositedover the ferroelectric layer 20 to a thickness of about 1750 Angstroms.The top electrode layer 22 is conformal and thus fills in each of theindentations 42.

In FIG. 47, the top electrode layer 22 is etched away to form one ormore top electrodes in indentations 42. Platinum is typically etchedusing a reactive-ion etch in an argon and chlorine atmosphere. Thedimensions of the individual top electrodes can modified as desired fromnominal dimensions of 1.5×1.5 microns, with a spacing of about threemicrons between top electrodes. After the platinum top electrode layer20 is etched to define the individual top electrodes, a second anneal isperformed. The second anneal includes a 650° C. heat treatment for aboutsixty minutes in an oxygen atmosphere.

In FIG. 48, a PTEOS glass dielectric layer 24 is deposited over theetched ferroelectric layer 20 to a thickness of about 5000 Angstroms.

In FIG. 49, contact holes are etched to provide access of the top andbottom electrodes 22 and 18. Contact hole 32 provides access to bottomelectrode 18, and contact holes 34 provide access to top electrodes 22.Contact holes 34 are etched through the dielectric layer 24 to allowmetalization of the top electrodes 22. Contact hole 32, however isetched through dielectric layer 24 as well as ferroelectric layer 20.Note, therefore, that contact holes 32 and 34 are etched in two separateetching steps. The dielectric oxide material can be etched away using afluorine-based wet or dry etch. The ferroelectric material is etchedused a reactive-ion etch. It is desirable that a sloped profile isetched into the contact holes. An optional recovery anneal can beperformed at this point in the process.

In FIG. 50, contact holes 32 and 34 are metalized to provide electricalaccess to bottom electrode 18 and top electrodes 22 as previouslydescribed above.

A plan view of the capacitor structure described above with respect toFIGS. 42-50 is similar to that shown in FIG. 25. The differences arethat there is no second level of ferroelectric material 30,and thecontour for ferroelectric material 20 should be removed.

Referring now to FIG. 51, a schematic diagram for a typical non-volatileferroelectric memory is shown having a transistor 52 coupled to aferroelectric capacitor 54. The configuration in FIG. 51 is known as aone-transistor, one-capacitor ferroelectric memory cell or “1T/1C” cell.One current node of the transistor 52 forms the bit line of the cell,and is designated 14, 46, 48 to correspond to regions in the integratedcell shown below in FIG. 52. The other current node of transistor 52 iscoupled to ferroelectric capacitor 54 at node 56. The gate 15 oftransistor 52 forms the word line of the memory cell. One end ofcapacitor 54 is coupled to transistor 52 at node 56, and the other endof capacitor 54 forms the plate line of the memory cell. The plate linenode is designated 18, 36, 48 to correspond to regions in the integratedcell shown below in FIG. 52.

Referring now to FIG. 52, a sectional view of a completely metalizedintegrated circuit ferroelectric memory cell having a bit line, a wordline, and a late line is shown. The memory cell includes a siliconsubstrate or epitaxial region 12, and a transistor formed in thesubstrate 12 including first and second diffused regions 14, a thin gateoxide 13, and a gate 15 forming the word line. A hick oxide layer 16 isformed on the substrate 12 including contact holes to allow metalizationof the first and second diffused regions 14. Note that in FIG. 52, theexact sequence for forming each of the various layers and contact holeswithin each layer is not fully described; the contact holes may actuallybe formed at a subsequent processing step. A ferroelectric capacitor issubsequently formed on the thick oxide layer 16, including a bottomelectrode 18, a ferroelectric layer 20+30, and a top electrode 22,wherein the ferroelectric layer 20+30 either partially or completelyencapsulates the top electrode 22. The ferroelectric layer 20+30includes a contact hole to allow metalization of the top electrode 22.

A first dielectric layer 24 is formed over the thick oxide layer 16 andthe ferroelectric capacitor, including contact holes to allowmetalization of the first and second diffused regions 14, and the topand bottom electrodes 22 and 18 of the ferroelectric capacitor. A firstpatterned metalization layer 36, 38, 46 is deposited for contacting thefirst diffused region 14 with metal contact 46, for forming a localinterconnect 38 between the top electrode 22 and the second diffusedregion 14, and for metalizing the bottom electrode 36 with metal contact36.

A second dielectric layer 44 is formed over the first metalization layer36, 38, 46 including contact holes to allow metalization of the firstdiffused region 14 and the bottom electrode 18. A second patternedmetalization layer 48 contacts the first diffused region 14 and formsthe bit line of the memory cell, and contacts the bottom electrode 18 toform the plate line of the memory cell. Finally, a passivation layer 50is formed over the second metalization layer 48.

Although the first and second dielectric layers 24 and 44 are typicallythin doped or undoped oxide layers, if greater resistance to hydrogendiffusion is required these layers can also be made of ferroelectricmaterials such as PZT or SBT. Still further, the passivation layer 50,while typically formed of silicon nitride or the like, can also be madefrom ferroelectric materials such as PZT or SBT. All three layersmentioned above can be fabricated of the same or different ferroelectricmaterials as desired, and not necessarily the same material as used inthe ferroelectric layer of the ferroelectric capacitor. Furtherteachings regarding ferroelectric material passivation can be found inU.S. Pat. No. 5,438,023 entitled “Passivation Method and Structure for aFerroelectric Integrated Circuit using Hard Ceramic Materials or theLike”, which is assigned to the assignee of the present invention,Ramtron International Corporation. While extra care can be taken to evenfurther reduce sensitivity to hydrogen, these steps may increasefabrication costs and complexity.

Enhanced-Lead Encapsulation Layer

Improved performance such as increased switched charge resulting fromdecreased line degradation has been demonstrated using the encapsulationlayer as shown and described above. However, it is now known thatfurther improvement is possible by controlling the amount of lead inencapsulation layer 30. Specifically, it is desirable that encapsulationlayer 30 contains excess lead (above the amount required to form astandard PZT perovskite structure) so that the amount of lead at theinterface between the ferroelectric layer 20 (the capacitor dielectriclayer) and the encapsulation layer 30 can be beneficially controlled. Itis believed at present that the surface of ferroelectric layer 20becomes lead-depleted during ferroelectric processing anneals, and thatthe excess lead in encapsulation layer 30 replenishes the lost lead.Therefore, for optimized performance, it is desirable to carefullycontrol the amount of lead in encapsulation layer 30. No excess lead inlayer 30 is not sufficient to restore the lost lead in ferroelectriclayer 20; however, too much excess lead in layer 30 can also degradeperformance.

A ferroelectric capacitor is shown in FIGS. 11, 19, and 26 and includesa bottom electrode 18, at least one top electrode 22, and aferroelectric layer 20 located between the top and bottom electrodes 22and 18. A PZT encapsulation layer 20 is used for completelyencapsulating the top electrode, except for a contact hole 34 to allowmetalization of the top electrode 22, wherein at least a portion of thePZT encapsulation layer 30 contains excess lead. The PZT encapsulationlayer 30 is clearly shown in FIGS. 13, 21, and 28, as well as subsequentdrawing figures. While the optimum amount of excess lead will varyaccording to the exact manufacturing conditions and process used, a PZTencapsulation layer 30 containing between about 5% and 50% excess leadis recommended as a starting, point. In a preferred embodiment of theinvention a PZT encapsulation layer 30 was used that contained about 20%excess lead. This amount of lead yielded a significant improvement inferroelectric memory performance indicia, such as switched charge.

As noted above, the amount of lead at the interface betweenferroelectric layer 20 and encapsulation layer 30 is important, since itis believed that the excess lead at this interface is used to replenishthe lost lead in layer 20. Therefore, it is desirable that the bottomportion of the PZT encapsulation layer 30 (i.e., closest toferroelectric layer 20) contains excess lead. In a preferred embodimentof the invention, electrical performance was tested with anencapsulation layer 30 in which the bottommost 300 Angstroms containedthe excess lead.

The PZT encapsulation layer 30 is typically about 3000 Angstroms thick,but an encapsulation layer 30 between about 500 and 5000 Angstromstthick can be used. The ferroelectric layer 20 is typically PZT, whichbecomes lead-depleted within the surface region during processinganneals. Ferroelectric layer 20 is also typically about 2400 to 3000Angstroms thick, but a layer 20 between about 500 and 5000 Angstromsthick can be used.

In general, the method of fabricating an improved ferroelectriccapacitor includes the steps of forming in sequence a bottom electrodelayer 18, a ferroelectric layer 20, and a top electrode layer 22;etching the top electrode layer 22 to form a top electrode 22; forming alead-enhanced PZT encapsulation layer 30 over the ferroelectric layer20, thereby completely encapsulating the top electrode 22; etching theencapsulation layer 30; and metalizing the top electrode 22 through theetched encapsulation layer 30.

The encapsulation layer 30 is formed via sputtering. The sputtering toolused was a Gryphon Reliance, the ambient sputtering atmosphere wasargon, and the deposition was conducted at room temperature. The PZTsputtering target used also contained trace amounts of a lanthanumdopant. The plasma inside the sputtering tool was stabilized with wafersparked outside the deposition zone and then the wafers were subsequentlyrotated through the plasma at ten RPMs for the time necessary to achievea film thickness of about 2400-3000 Angstroms.

Deposition times for the first portion of encapsulation layer 30 werefrom six to twelve minutes depending on the power and pressure used toachieve a thickness of about 300 Angstroms. The deposition times for thesecond portion of encapsulation layer 30 ranged from 41 minutes to 46minutes.

The lead content of the encapsulating layer 30 in the first 300Angstroms of the film was varied between approximately 20% excess leadto 50% excess lead as follows:

Excess Lead Pressure Deposition Power 20%  6 mT pressure 1000 wattsdeposition power 30% 18 mT pressure  700 watts deposition power 40% 30mT pressure  700 watts deposition power 50% 42 mT pressure  700 wattsdeposition power

The remainder of the film (i.e. the bulk or second portion) wasdeposited at 6 mT and 1000 watts of deposition power. The lower leadcontent (20%) at the interface between ferroelectric layer 20 andencapsulation layer 30 provided the best performing encapsulation interms of process immunity and improved electrical performance. However,it is believed that other, lower, percentages down to 5% excess lead mayalso reduce line degradation and lead to an improvement in electricalperformance.

Individual process flows obviously incorporate variations in temperaturecycling based on selection of backend equipment and processing.Therefore, the amount of actual excess lead used, and the excess-leadprofile in encapsulation layer 30 will have to be optimized to eachspecific process flow.

Potentially, encapsulation with other forms of lead-containing films ispossible (e. g. lead titanate, lead oxide, as well as other non-PZTlead-based compounds). However, minimization of the number of sputteringtargets required to support the manufacturing flow is desirable. Themethod of the present invention can be adapted to use CVD (“ChemicalVapor Deposition”) processing or even CSD (“Chemical SolutionDeposition”) if corresponding planarization schemes are incorporated.

Having described and illustrated the principles of the invention in apreferred embodiment thereof, it is appreciated by those having skill inthe art that the invention can be modified in arrangement and detailwithout departing from such principles. For example, the followingaspects of the semiconductor processes described herein can be changedas required: the types of dielectric materials; the thicknesses of thevarious layers; the types of ferroelectric materials; the etchingprocesses; the electrode materials; and the anneal temperatures,durations, and numbers. Also, the specific application of theferroelectric capacitor of the present invention is not limited toferroelectric memory cells, although it is ideally suited to thatapplication. We therefore claim all modifications and variation comingwithin the spirit and scope of the following claims.

We claim:
 1. A method of fabricating a ferroelectric capacitor, themethod comprising the steps of: (a) forming in sequence a bottomelectrode layer, a ferroelectric layer, and a top electrode layer; (b)etching the top electrode layer to form a top electrode; (c) forming alead-enhanced PZT encapsulation layer over the ferroelectric layer,thereby completely encapsulating the top electrode; (d) etching theencapsulation layer; and (e) metalizing the top electrode through theetched encapsulation layer.
 2. The method of claim 1 in which step (c)comprises the step of forming a PZT encapsulation layer, a portion ofwhich contains between about 5% and 50% excess lead.
 3. The method ofclaim 1 in which step (c) comprises the step of forming a PZTencapsulation layer, a portion of which contains about 20% excess lead.4. The method of claim 1 in which step (c) comprises the step of forminga PZT encapsulation layer, a bottom portion of which contains excesslead.
 5. The method of claim 1 in which step (c) comprises the step offorming a PZT encapsulation layer, a bottommost 300 Angstroms of whichcontains excess lead.
 6. The method of claim 1 in which step (a)comprises the step of forming a PZT ferroelectric layer.
 7. The methodof claim 1 in which step (a) comprises the step of forming alead-depleted PZT ferroelectric layer.
 8. A method of fabricating aferroelectric capacitor comprising: (a) forming a bottom electrodelayer, a ferroelectric layer, and a top electrode layer; (b) etching thetop electrode layer to form a top electrode; and (c) forming alead-enhanced PZT encapsulation layer over the ferroelectric layer. 9.The method of claim 8 in which forming the encapsulation layer comprisesforming a lead-enhanced PZT encapsulation layer in which a bottomportion of the layer contains excess lead.